Intel Poised To Power Next Gen Tech Giants As Google And Amazon Set Sights On Revolutionary Computing Solutions

Intel is at the forefront of a technological revolution that is set to change the way we approach computing and artificial intelligence. The company’s advanced packaging services, including its EMIB-T technology, are being touted as a game-changer in the industry. According to a recent report by WIRED, Intel is in talks with two major customers - Google and Amazon - to provide these services, marking a significant development for the company.

The partnership between Intel and these tech giants represents a major shift in the way that computing is done. With the rise of AI and machine learning, the need for faster, more efficient computing has become increasingly important. Intel’s advanced packaging solutions, including EMIB-T, are designed to meet this demand.

EMIB-T is the latest iteration of Intel’s 2.5D technology, which embeds small silicon bridges in the package substrate to connect chiplets. The new version adds through-silicon vias to the bridge for improved power delivery and signal integrity. This upgrade allows EMIB-T to support packages up to 120x180mm, accommodating more than 38 bridges and over 12 reticle-sized dies.

The potential of EMIB-T is significant, with industry experts predicting that it could revolutionize the way that computing is done. “Even more so than the silicon itself, chip packaging is going to transform how this AI revolution comes to fruition over the next decade,” said Naga Chandrasekaran, head of Intel Foundry.

Intel’s New Mexico advanced packaging fab, which received $500 million from the CHIPS Act and has been operational since January 2024, is a prime example of this transformation. The facility is pushing the boundaries of what is physically possible in terms of chip stacking and interconnection using Foveros technology and EMIB.

The Penang advanced packaging complex in Malaysia is also making significant strides. The facility, which is 99% complete, will begin first-phase assembly and testing operations later this year, according to Malaysian Prime Minister Anwar Ibrahim. This represents a major milestone for the project and highlights Intel’s commitment to expanding its presence in Southeast Asia.

In addition to these initiatives, Intel has also outsourced EMIB production for the first time to Amkor’s Songdo K5 facility in South Korea. The company plans to open additional sites in Portugal and Arizona, further expanding its global footprint.

The potential revenue implications of these partnerships are significant. CFO Dave Zinsner revised his packaging revenue projections over the previous 12 to 18 months from hundreds of millions of dollars to “well north of $1 billion.” He also noted that packaging could achieve the same 40% gross margins Intel claims on its core product business.

However, it is worth noting that these projections contrast sharply with the division’s current financials. Intel Foundry posted $4.5 billion in revenue for Q4 2023 and a $2.5 billion operating loss. External foundry revenue for the full year totaled just $307 million, mostly from U.S. government contracts and residual Altera work.

Despite this, the outlook for Intel’s packaging business is still positive. The company has invested heavily in expanding its capacity across three countries - New Mexico, Malaysia, and South Korea. This expansion is set to enable the production of more advanced packaging solutions, including EMIB-T, which will be critical for meeting the demands of AI computing.

As the technology continues to evolve, it is likely that we will see even more innovative applications of EMIB-T. With its ability to support packages up to 120x180mm and accommodate over 38 bridges and 12 reticle-sized dies, this technology has the potential to revolutionize the way that computing is done.

The impact of this technology will be felt across multiple industries, from healthcare and finance to gaming and entertainment. As AI continues to become increasingly ubiquitous, the need for faster, more efficient computing will only continue to grow.

As Intel’s advanced packaging services, including EMIB-T, move forward, it is clear that the company is committed to innovation and expansion. With its partnerships with Google and Amazon, as well as its investment in global capacity, Intel is poised to play a major role in shaping the future of computing and AI.

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