Eliyan Corporation Makes Significant Leap in Optical Interconnects, Securing $145 Million Series C Funding

In a breakthrough move, Eliyan Corporation, a leader in electrical chiplet interconnects, has announced the closure of a $145 million Series C funding round at a staggering valuation of $1 billion. The Santa Clara-based company has secured the investment from Seligman Ventures [1](https://aiwirenews.com/seligman-ventures/), Cisco Investments, and Lumentum, three strategic investors with expertise in optical networking. This significant funding will enable Eliyan to expand its product offerings into electro-optical links for AI systems, solidifying its position at the forefront of the rapidly evolving interconnect landscape.

A New Frontier in Interconnects

Eliyan’s NuLink physical-layer cores and NuGear chiplets have been widely adopted by customers seeking to optimize data transfer between dies sharing a package and between separately packaged chips across a circuit board. The company’s innovative designs utilize standard organic substrates, eliminating the need for costly silicon interposers or bridges, which significantly reduces thermal risk and yields in multi-die designs.

The Optical Expansion

This strategic move marks Eliyan’s entry into the optical interconnect market, where the constraint has shifted from compute throughput to memory bandwidth and off-package I/O bandwidth. The company’s optical expansion is poised to address the growing demand for high-speed data transfer in AI systems, which are increasingly becoming a performance-defining technology of modern AI data centers.

NuLink-XD: A Game-Changing SerDes

On July 24, 2026, Eliyan introduced its latest product, NuLink-XD, [2](https://aiwirenews.com/industry-pioneers-unveil-revolutionary-quad-chiplet-9f0547/), a 224G PAM4 SerDes built on TSMC’s 3nm process. This innovative chiplet is designed to reduce power consumption by up to 40% by allowing designers to tune the power-versus-reach tradeoff for specific electrical channels. The significance of this technology lies in its ability to address the limitations of passive copper, which becomes impractical for rack-to-rack connections at 224G and above.

Scaling Up and Scaling Out

Eliyan’s optical expansion is critical as AI scale-up fabrics require exponentially more links than every other interconnect in a system combined. A watt saved per link multiplies across a pod, making the company’s solution increasingly attractive to hyperscale data center operators.

A Strong Network of Strategic Investors

The new investors have deep expertise in optical networking and silicon supply chain diversification, providing Eliyan with access to channel partners and strategic relationships that will be instrumental in driving growth. Seligman Ventures joins an impressive roster of 12 strategic investors, including AMD, Arm, Coherent, Meta, Samsung Catalyst Fund, Intel Capital, and Lumentum [3](https://aiwirenews.com/tsmc-unveils-ambitious-3d-stacking-plan-to-fuel-next-gen-bcb345/).

Ecosystem Partnerships and Next-Generation Development

The proceeds from this funding round will be allocated towards next-generation interconnect development, ecosystem partnerships, and scaling manufacturing. Eliyan is working closely with lead customers to design NuLink-XD into their next system generation, marking a significant milestone in the company’s commitment to delivering high-performance solutions for AI infrastructure.

A Step Forward in Interconnect Innovation

Eliyan Corporation’s strategic move into optical interconnects has sent shockwaves through the industry. With its innovative designs and strong network of strategic investors, 4, the company is poised to drive growth and innovation in the rapidly evolving landscape of interconnect technology. As the performance-defining technologies of modern AI data centers continue to shift, Eliyan’s commitment to delivering high-performance solutions will be at the forefront of this revolution.

References:

• [Nvidia Unveils $4 Billion Bet on Future of AI with Groundbreaking Photonics Investment](https://aiwirenews.com/nvidia-unveils-4-billion-bet-on-future-of-ai-with-b6db96/)
• [Industry Pioneers Unveil Revolutionary Quad-Chiplet AI Accelerator](https://aiwirenews.com/industry-pioneers-unveil-revolutionary-quad-chiplet-ai-9f0547/)
• [Intel poised to Power Next Gen Tech Giants as Google and Amazon Set Sights on Revolutionary Computing Solutions](https://aiwirenews.com/intel-poised-to-power-next-gen-tech-giants-as-google-and-b9a14f/)
• [TSMC Unveils Ambitious 3D Stacking Plan to Fuel Next Gen Computing](https://aiwirenews.com/tsmc-unveils-ambitious-3d-stacking-plan-to-fuel-next-gen-bcb345/)

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